Want a slimmer model? Honor has you covered!

HONOR showcased its commitment to AI innovation at IFA 2024, unveiling groundbreaking AI-enabled hardware capabilities and a collaborative AI privacy protection architecture that combines on-device and cloud AI technologies.

The global technology brand introduced its AI Deepfake Detection anti-fraud technology, a world first, and debuted the HONOR Magic V3, the world’s slimmest inward foldable smartphone, among its latest AI-empowered flagship devices.

HONOR CEO George Zhao emphasized the company’s role in creating better and more secure AI experiences that meet consumers’ needs, while collaborating with Google to integrate features based on Google Cloud AI models and APIs into HONOR devices.

The HONOR Magic V3, with its sleek folded thickness of 9.2mm and featherlight body weighing just 226g, rivals the slimness and weight of a flagship bar phone, thanks to the meticulous application of 19 innovative materials and 114 microstructures.

The device’s dome-shaped octagonal camera module showcases a diamond cut, adding elegance and sleekness to its overall appearance.

Equipped with a 6.43-inch external display and a 7.92-inch internal foldable screen, the HONOR Magic V3 delivers an immersive dual-use experience, while incorporating innovative eye-comfort features such as the world’s first AI Defocus Display technology, 4320Hz Risk-free PWM Dimming, Dynamic Dimming, Circadian Night Display and Natural Tone Display.

Powered by the Snapdragon® 8 Gen 3 Mobile Platform, the HONOR Magic V3 offers a host of intelligent features, including Magic Portal on Foldable, HONOR AI Motion Sensing, HONOR AI Portrait Engine, HONOR AI Eraser, Face to Face Translation, and HONOR Notes tools, delivering on HONOR’s promise of a new era of AI-enabled versatility and productivity[7].